soldered

soldered

1. The 1710 series threaded and solder end range are "T" pattern globe style valves.

1710系列螺纹和焊接连接端口为T形截止阀结构的阀门。

2. Solder side is chosen to measure.

4量测以吃锡面为选择点。

3. BGA measurement is measured for inside solder point.

BGA量测以最内侧焊点为量测依据。

4. Q: Will IPC be publishing a new specification for inspection of lead-free solder joints?

IPC是否会颁布新的关于无铅焊接的质检标准?

5. Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester.

Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。

6. Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester.

Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。

7. RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste.

RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。

8. TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable.

TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。

9. A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.

一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。

10. SMOBC: Solder mask over bare copper.

一种阻焊层覆盖裸铜的工艺。

11. Type of high density solder mask.

一种高密度焊料掩膜。

12. Generally the same fluxes will work for lead-free solder.

一般来说,相同的焊剂用于无铅焊料是有效的。

13. Generally, solder alloys with more than about 8% bismuth will be brittle.

一般来说,铋含量超过8%的焊料合金将会变脆。

14. Not all MCMs have Solder Balls or Leads to realize electrical connecting.

不是所有的MCM都采用焊球或引脚和外界相连。

15. I wish he'd been soldered in lead.

不是靠林惇那边，滚他的！我愿把他用铅焊住。

16. Do not solder directly to cells or batteries.

不要直接对电池进行焊接。

17. The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

18. Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched.

丝印模板,锡浆网,胶水网

19. To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度，锡膏在晶片焊盘过焊。

20. To further reduce equivalent series resistance and improve long term reliability, the leads are then soldered with lead free silver solder.

为了进一步的减少等效串联阻抗和改善,长期的信赖度,引线是以无铅银焊锡来接焊。

21. Solder end valves also available.

也可以提供焊接连接端口的阀门。

22. The amount of refund tax should be consult with the solder .

买单公司的退税金额应该和卖单企业商议。

23. So it will result in rigidity skin &block and solder balls etc.

产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。

24. Tang had never managed to fire his weapon, which in a police photo appeared to have been soldered together.

从警方公布的照片看，他的枪是焊接而成的。

25. Careful inspection showed that the statue's head had been cast separately and soldered in place.

仔细检查发现雕像的头部是铸好后再焊接上去的。

26. He soldered the broken wires together.

他将断了的电线焊接起来。

27. He soldered the wire back on.

他把金属丝重新焊上去了。

28. Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.

低漏电流,小巧,端子嵌入或焊锡,方便安装和使用。

29. All electronics assemblies using lead in solder.

使用含铅焊料的所有电子配件。

30. What are the patent issues with using lead-free solder?

使用无铅焊料涉及的专利问题有哪些?

31. What are the main qualification tests for using lead-free solder paste?

使用无铅焊锡膏的主要评选测试有哪些?

32. Stir solder paste in container before use.

使用时搅拌容器内的焊膏。

33. Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.

例如，不够充足的焊料，元器件对准不佳、遗漏旁路电容和电源针开路。

34. Separation of the component lead from the solder fillet.

元件面或焊锡面的零件脚旁焊锡裂开。

35. Bare laminate, copper, solder resist or other surface.

光面基材，覆铜板，绿油之或其它表面。

36. For bracelets, I invented a way of substituting for slides of soldered sheet iron, slides of iron laid together.It is prettier, better and less costly.

关于手镯，我发明了不用焊药焊住金属扣环，而是把金属扣环搭紧，这样比较美观，而且价廉物美。

37. Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis.

关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析

38. The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder.

凯斯特公司创立于1899年,当时公司名为芝加哥焊锡公司,主要产品是带有焊剂芯的焊锡。

39. Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.

助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。

40. Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

41. Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏。

42. Air distribution piping systems almost invariably use soft copper tubing with soldered fittings.

压缩空气的分配管道系统无例外地都是用焊接管件的铜管。

43. The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用。

44. Only partial removal of the contaminated solder pot will get the Pb concentration back below 0.1% wt.

只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。

45. Available with threaded (-UT), solder (-US), PEX or CPVC connections.

可提供螺纹连接（-UT），焊接连接（-US），PEX或CPVC连接方式。

46. Settable for dipping time. Used solder cup to bring up tin from pot.

可设定焊锡时间,采用子式锡杯,母式锡炉.

47. The liquidus temperature increases with increasing Ag % of the solder.

合金之液相线温度随银含量增加而提高。

48. At the same time,experiments on PBGA solder ball laser reflow were carried out.

同时，本文还对PBGA钎料球激光重熔进行了试验研究。

49. After drilling a hole for the brass tubing and another hole for the clevis, I mounted and soldered both horns in place.

后钻孔为黄铜油管和另一孔为clevis ，我安装和焊接都犀角，在地方。

50. Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?

回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?

51. Therefore,it is necessary to study the reliability of this mixed solder joint.

因此,有必要对形成的混合焊点进行可靠性分析。

52. Therefore, it is necessary to study the reliability of this mixed solder joint.

因此，有必要对这种混合焊点进行可靠性分析。

53. Free-form shapes are soldered together to make a bracelet. 3.

图2：以点熔方式，造成手镯边缘凝敛的效果。

54. After SMT component placement, boards are typically wave soldered to permanently and securely affix the components to the board surface.

在SMT元器件贴装之后，典型的工艺是进行波峰焊，以便永久、可靠地将元器件固定到印板表面。

55. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.

在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。

56. Is it possible to decrease dross (oxide) generation when using Sn96.5Ag3Cu0.5 Solder?

在使用Sn96.5Ag3Cu0.5焊料时,是否可以降低氮(氧)的产生?

57. At the end of the nineteenth century BCE an ambitious solder called Shamshi-Adad brought Ashur under his control.

在公元前十九世纪末，一位野心勃勃的士兵，名为沙姆希-阿达德，他使亚述在他的控制之下。

58. In other word, the battery which was spot-welded will be able to last longer as compared to those that were soldered.

在其他词，电池是点焊将能够持续的时间相比，这些被焊接。

59. Based on the analysis of failure of soldered points, the ways of improving the reliability of soldered points are discussed in the present paper.

在分析焊点失效原因的基础上,论述了改善焊点可靠性的途径。

60. Three lead wires are soldered to the anchor terminals.

在固定接线端子上焊有三根导线。

61. Q: How do I keep my employees from mixing lead-free and leaded solder and equipment on the line?

在有铅和无铅焊锡混合应用的生产线上，怎样进行设备和物料管理?

62. Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula.

在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。

63. Remove excess solder with small brush while plastic (soft), leaving a fillet around end of valve as it cools.

在焊接部分成型后，用小刷子清除多余的焊料，使其在焊料冷却后形成一个环绕连接端口的圆角。

64. It is not advisable to bend or handle a capacitor after it has been soldered to the PC board.

在电容器焊装到电路板，请勿强烈摇动电容器。

65. Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.

在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。

66. At this stage, it's easy to remake a solder connection if there is a problem.

在这一阶段，如果存在问题，可以很容易地改造焊接的连接点。

67. In this case the solder pot has to be changed or coated and the solder bar has to be replaced.

在这种情况下,必须更换或涂抹焊料槽,并更换焊料棒。

68. Here, I have soldered another piece of brass thus connecting the two together.

在这里，我有焊接另一块黄铜，因此连接两者。

69. ADJUSTED PRESSURE/TEMPERATURE RATINGS FOR JOINTS MADE OF COPPER TUBE AND SOLDER END VALVES?

在连接铜管和焊接端口阀门时要核对压力/温度额定值?

70. The solder paste may be adaptable to bond kovar and W-Cu materials, kovar and ceramics etc.

在钎焊过程中，镍基板上的镍与钎料中的元素铜存在元素扩散。这对改善钎料与基体之间的结合状况是有益的。

71. The ground solder for the Vrs.

地面焊料的越南难民。

72. What is a good method for solder bar addition for lead-free solder bar?

如何才能很好的为无铅焊料棒添加焊料棒?

73. If you add solder and you can make that circuit substitute for a maze of conventional wiring.

如加上焊料，你就可以使板上面的电路代替那种用旧方法连接起来的迷宫一样的线路。

74. If we are unable to remove the oxide coat even it is reluctantly soldered the bonding strength is very weak.

如果我们未能将氧化层除去，即使勉强沾上焊锡，其结合力量也是非常弱的。

75. If any wires are crimped or soldered, these connections will need to be tested for their strength using a pull test.

如果有任何电线轧花或焊接，这些连接将需要检测其强度使用下拉测试。

76. When Cu content of solder is increased, liquidus temperature also rises unfortunately.

如果焊料中的铜含量提高,液相线的温度也会提高。

77. If too much solder is use, it may flow past tube and clog seating area.

如果采用太多的焊料，则焊料可能流过管道并阻塞密封区域。

78. If the metal that was under the gold is not oxidized, the gold-contaminated solder will bond to it.

如果镀金层覆盖的金属没有氧化,则带有金成分的焊料将会粘连在该金属上。

79. Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?

对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?

80. Do not touch solder paste bare-handed. Remove with ethyl alcohol from body or clothes if contaminated by solder paste.

小心使用焊膏,避免触及皮肤。若附于衣服或身体时,应尽快用含有酒精的溶剂把焊膏抹掉。