wafers

wafers

1. N type and P type 4＂-6＂silicon epitaxial wafers.

4＂-6＂N型和P型各类硅外延片。

2. The EASYLINE 8031 is the cost-effective solution for sorting dice into waffle pack, jedec matrix trays or bonding onto artifical wafers.

EASY LINE 8031是具有较高价格/性能比的芯片分选机，它可以把芯片排序于编带或各类载片盒中。

3. LDK makes silicon wafers, a key ingredient in solar cells, which in turn are used in solar panels.

LDK生产晶圆，这是太阳能电池的主要材料。而太阳能电池则用于太阳能板中。

4. The spacecraft collected ions that had been blown by solar winds on wafers of silicon, diamond, sapphire, gold and other materials.

“起源”号太阳探测飞船用各种材料的晶片来收集被太阳风吹来的太阳粒子，其中包括硅、钻石、蓝宝石、金子和其它物质制成的晶片。

5. Some historians believe that it may have been responsible for reports of 'blood' on communion wafers and other bread.

一些历史学家相信这可能是“血”在圣餐礼的圣饼和其它供品上出现的原因。

6. Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices(usually in wafer form) are added subsequently.

一种微电子电路器件，其中的无源元件及内部金属连线直接在绝缘衬底上形成，然后再加上有源半导体器件(通常以大圆片形式给出)。

7. A wafer of a moon was shining over Gatsby's house, making the night fine as before.

一轮明月正照在盖茨比别墅的上面使夜色跟先前一样美好。

8. Internal and outsource wafer sort/final test support, abnormal yield analysis.

中测、成测生产线支持，成品率异常分析。

9. Internal and outsource wafer sort/ final test support, abnormal yield analysis.

中测、测生产线支持，成品率异常分析。

10. Laser making of wafers for identification purpose will also become a new attribute.

为了定位，片子上的激光标记也将成为新的标志。

11. To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度，锡膏在晶片焊盘过焊。

12. Primary Orientation Flat - The longest flat found on the wafer.

主定位边-晶圆片上最长的定位边。

13. Our main product range includes SMD (surface applying), HC/49U/S and high-quality crystal wafers.

主要产品有SMD（表面贴装）、HC/49U/S、高品质石英晶片。

14. The experiment of fully automatic reactive ion etching on 3 inch GaAs wafer is described.

介绍了全自动反应离子腐蚀3英寸GaAs片的实验研究工作。

15. They etched a channel into a silica wafer but left standing in the channel evenly spaced columns of pillars.

他们在矽晶圆上蚀刻出一条通道，而在通道里留有均匀间隔列队的栏柱。

16. They were not satisfied that they could not use underground wafer.

他们对不能使用地下水感到很不满。

17. He was the priest who beholds all his sacred wafers cast to the winds, the fakir who beholds a passer-by spit upon his idol.

他好象是个望着别人把圣饼满地乱扔的神甫，是个看见过路人在他偶像身上吐唾沫的僧人。

18. He advanced to his Uncle with the wafer of communion bread in his hand.

他手里拿着圣餐面包和圣饼，向他叔叔走去。

19. He predicted traffic growth will continue, justifying the company's massive investments in factories that turn silicon wafers into chips.

他预测流量的增长还将继续下去，从而证明该公司大规模投资芯片生产厂的合理性。

20. Two scoops of your choice served in freshly baked waffle basket, garnished with chocolate cone and rolled wafer.

任选双球冰淇淋盛装在花式脆饼皮中，搭配捲心酥及巧克力酱点饰。

21. Electroglas has been in wafer prober business for over 40 years.

伊智公司(Electroglas)在晶圆探针台领域已经有超过40的年历史了。

22. To smooth the surface of a wafer or semiconductor crystal.

使晶片或半导体晶体的表面光滑的过程。

23. The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%.

倒装焊晶片市场预计年增长37%，而整体IC增长仅8%。

24. The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.

倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。

25. Lithography - The process used to transfer patterns onto wafers.

光刻-从掩膜到圆片转移的过程。

26. ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer.

光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。

27. After completely processed wafers are tested, those chips that pass the tests are ready to be packaged.

全部工艺完成后，片子要进行测试，合格的片子便去封装。

28. Implanting hydrogen ions into the germanium wafer to from an in-depth weaken layer.

其中氢离子布植技术是氢离子布植到锗晶圆至适当深度。

29. The hippocampal cells show tight adherence on silicon wafers with nano-scale surface topograph.

其中重要的基础研究问题就是理解和控制神经元与材料的界面反应。

30. The method is to coat a wafer of silicon with a protective layer of silicon dioxide.

其方法是往硅片上涂上一层二氧化硅防护膜。

31. Lug-style is a wafer body but has tapped lugs matching up to bolt circle of Class 125/150 flanges.

凸耳式:平板式阀体,但是具有螺纹凸耳,用于通过螺栓与125/150磅级法兰连接。

32. Notch - An indent on the edge of a wafer used for orientation purposes.

凹槽-晶圆片边缘上用于晶向定位的小凹槽。

33. Blade-type Cutting Machine:cuts the wafers to set size , and the cutting direction changing to have longitudinal and cross will be done automatically.

刀片式切割机：可按预定尺寸准确切割威化饼片，纵横两向的切割转换自动完成。

34. Slip - A defect pattern of small ridges found on the surface of the wafer.

划伤-晶圆片表面上的小皱造成的缺陷。

35. W. Lee, and S. W. Kim, “An Ultraprecision Stage for Alignment of Wafers in Advanced Microlithography,” Prec. Eng., Vol. 21, pp.113-122, 1997.

刘永田，“奈米定位技术”，奈米工程技术研讨会，国立高雄应用科技大学机械工程系，国立高雄应用科技大学，第十二期，一月，2003年。

36. The layout was designed with L-EDIT and the wafers were fabricated with double-polysilicon, N well CMOS process.

利用L-EDIT进行全定制版图设计，利用双层多晶硅N阱CMOS工艺进行芯片制造。

37. Clean rooms, where wafers are made, are de signed to keep human handling and airborne particles to a minimum.

制造晶片的干净房间被设计得将人为影响、灰尘等微粒子降到了最低程度。

38. Hot plate with silicon wafer in initial configuration (before heating).

加热板与矽晶圆在启始状态(加热前)。

39. Hot plate with silicon wafer lowered to heating position.

加热板与矽晶圆降低至加热位置。

40. A low concentrations of Br2-MeOH were used for the chemical polishing of InSb wafers.

化学抛光可以有效地去除表面划痕,改善晶片的表面形貌，降低粗糙度。

41. Semiconductor capital equipment, wafer and chip manufacturers and distributors.

半导体材料设备和晶片制造商和分销商。

42. Chuck Mark - A mark found on either surface of a wafer, caused by either a robotic end effector, a chuck, or a wand.

卡盘痕迹-在晶圆片任意表面发现的由机械手、卡盘或托盘造成的痕迹。

43. Chuck Mark -A mark found on either surface of a wafer, caused by either a robotic end effector, a chuck, or a wand.

卡盘痕迹在晶圆片任意表面发现的由机械手、卡盘或托盘造成的痕迹。

44. Cook rolled out the pastry till it was as thin as a wafer.

厨师把和好的面擀得非常薄。

45. Eject-up level too high &pick up level too low. Die was cracked when the collet reaches the wafer.

只想到这两点，不知对不对，有不对的请指出啊！大家进步才是真的进步！哈哈

46. Edge Exclusion, Nominal( EE)- The distance between the fixed quality area and the periphery of a wafer.

名义上边缘排除(E)-质量保证区和晶圆片外围之间的距离。

47. Edge Exclusion, Nominal (EE) - The distance between the fixed quality area and the periphery of a wafer.

名义上边缘排除(EE)-质量保证区和晶圆片外围之间的距离。

48. In the latter case the pressure is raised and the wafer is mounted on the grounded electrode.

后者的压力升高硅片放置在接地的电极上。

49. Cycle time is a key performance index for wafer foundries and should not be ignored in their tool planning.

周期时间是晶圆代工厂重要的生产绩效指标，所以在机台规划时不应该被忽略。

50. Cheese wafers and potato chips are really very good snacks for coffee break.

喝早茶时吃些奶酪薄片和炸薯条最好不过了。

51. Four-Point Probe - Test equipment used to test resistivity of wafers.

四探针-测量半导体晶片表面电阻的设备。

52. The four-point probe method is used on very thin samples such as epitaxial wafers and conductive coatings.

四探针法用在非常薄的样品，例如外延晶圆片和导电涂层上。

53. FourPoint Probe Test equipment used to test resistivity of wafers.

四探针测量半导体晶片表面电阻的设备。

54. A covered receptacle for holding the consecrated wafers of the Eucharist.

圣体盒，有盖圣杯圣餐中有盖的装献祭圣饼的容器

55. A container in which wafers for the Eucharist are kept.

圣饼盒装圣餐用的饼干的容器

56. The dust produced during slicing weighs almost as much as the wafers.

在切割时所产生的碎屑几乎和薄片一样重。

57. We present a FEM method for forecasting the suitable pressure on the retaining ring,which is critical in manufacturing good quality wafers.

在晶圆外部施加保持环可以把晶圆中心处和边缘处的抛光垫压平到一致高度,克服晶圆边缘的"过磨"现象。

58. Inthe 3rd generation of Common Rail for passenger cars, the injectoractuators consist of several hundred thin piezo crystal wafers.

在第3代共同为铁路客车，喷油器驱动器构成的几百薄压电晶体晶圆。

59. In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers (Figure 4).

在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。

60. Metal contamination in Czochralski (CZ) silicon wafers is one of the important issues in device fabrication processes.

在集成电路工艺过程中，金属玷污会对器件的性能有着致命的影响。

61. Mound - A raised defect on the surface of a wafer measuring more than 0.25 mm.

堆垛-晶圆片表面超过0.25毫米的缺陷。

62. Large diameter wafers are feasible and 200-mm wafers have been produced.

大直径片子已不难制造，200mm的片子也已产生了。

63. Most conventional solar cells are made up of silicon wafers, a brittle substance that limits where they can be placed.

太阳能电池，能量转换成电能的太阳，是在不断增长的需求由于石油价格不稳定和关注全球变暖。

64. Oreo chocolate Wafer is a new member of the family.

奥利奥巧克力威化是奥利奥家族的新成员。

65. She tilted back her head and opened her mouth to receive the papery thin wafer.

她仰起头，张开嘴，准备领取像纸一样薄的小面饼。 这是最可怕的时刻。

66. She opened her mouth to receive the papery-thin wafer.

她张开嘴领受薄薄的圣饼。

67. For Wafer Style Butterfly Valves replace the "GO" prefix with "GOW" in the part number.

如果用于对夹式蝶阀，将型号中的“GO”前缀用“GOW”来代替。

68. For Wafer Style Butterfly Valves replace the "CO" prefix with "COW" in the part number.

对于对夹式蝶阀，将型号中的“CO”前缀用“COW”替换。

69. Structure designing and key processing technologies for wafer level package(WLP) were studied.

对圆片级封装(WLP)的结构设计和关键工艺技术进行了研究;

70. The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically.

对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。

71. Mold a non-abrasive, synthetic clay bar into a pancake-looking wafer.

将一块新的研磨泥碾成蛋糕状。

72. Lay - The main direction of surface texture on a wafer.

层-晶圆片表面结构的主要方向。

73. Personnel must wear proper clothing to protect the wafers.

工作人员必须穿适当的服装以保护硅片。

74. Dozens of engineers visually check wafers and hand-mark the defective regions leading to a significant amount of personnel cost.

工程师需以肉眼检查晶圆并手动标记缺陷区域，此举往往无可避免地导入可观的人事成本。

75. Available in Wafer (52 and 62) or Lug (54 and 64) style body.

平板型（系列52和62）和吊耳型（系列54和64）阀体。

76. Wafer body features four alignment holes.

平板阀体配置四个校对孔。

77. Flat - A section of the perimeter of a wafer that has been removed for wafer orientation purposes.

平边-晶圆片圆周上的一个小平面,作为晶向定位的依据。

78. Applied range : solar wafers, semiconductors, etc.

应用范围：太阳能硅片、半导体等。

79. A New Method of Resistless Photochemical Etching for Silicon Wafer[J].

引用该论文 杨杰,刘焰发,村原正隆.

80. Kern, W., 1993, Handbook of Semiconductor Wafer Cleaning Technology, Noyes, U.S.A.

张俊彦、郑晃忠，1997，积体电路制程及设备技术手册，经济部技术处，台湾。